Mechanical Through-hole


Through-hole connection system – mechanical


A simple method of achieving "plated-through" holes without investing in an electroplating system, this mechanical process permits quick and cost-effective conductivisation of holes in circuit board holes.

Three sizes: 0.8mm, 1.0mm, 1.2mm;
Perfectly flat finish both sides (unlike eyelets and pins) – SMT-friendly;
Hollow (unlike pins) – suitable for through-hole components;
Pure copper for optimum conductivity

0.8mm Through-hole Kit 1.0mm Through-hole Kit 1.2mm Through-hole Kit
0.8mm 1.0mm 1.2mm

Kits are available in three sizes: 0.8mm, 1.0mm and 1.2mm. Each kit contains tooling and sufficient bails for 250 holes, one size per pack.

Additional packs of bail-bars are available, 10 strips of 25 bails = 250 holes, one size per pack.

What's the process?

It's a simple manual system which applies a conductive coating to the walls of a circuit board hole while maintaining a flat surface on both sides of the circuit board.

After hand-setting, the holes are left with a solder-plated copper wall and a solder-filled barrel. If a through-hole is not required, top and bottom pads are simply soldered. Where a through-hole is necessary, the solder core is removed with a de-soldering tool or wick after soldering both sides.

Either way, your holes are left with a tin-plated electrolytic-quality copper sleeve pressed into the hole walls, flat on both sides of the circuit board.

Three sizes are available: 0.8mm, 1.0mm and 1.2mm.

How does it work?

Bail-bars consist of lengths of solder wire which have been electroplated with pure copper, then over-plated with tin and scored at intervals of approximately 2mm. Each bail-bar is divided into 25 bails.
An insertion tool is used to insert the end of the bail-bar into the hole. The bail-bar is snapped off to leave one bail in the hole.
An automatic snap punch is placed over the end of the bail and pressed down, compressing the bail lengthwise and expanding it radially into the walls of the hole.

After soldering both sides of the board to ensure connection between the pads and the sleeve, the hole may be de-soldered if a clear through-hole is required. Even if the application does not require a through-hole, de-soldering is still recommended to confirm that a satisfactory connection has been achieved.

What's in the kit?

Kits are available in three sizes (0.8mm, 1.0mm and 1.2mm), each kit comprising:

  • Insertion tool;
  • Punch;
  • 10 bail bars (= 250 holes);
  • 5 appropriately sized drill bits (1.5" long, 0.125" shank to suit Quick Circuit);
  • Anvil.

(Additional packs of 10 bail-bars are available without the tooling.)